Semiconductor

Semiconductor

Cleaner Fabs. Safer Processes.

Front-end semiconductor manufacturing is one of the most chemically intensive industrial processes in existence. Wafer fabrication involves etching, chemical vapour deposition, and chamber cleaning steps that generate a complex mix of hazardous gases, including acidic gases such as hydrogen fluoride, HCl, sulfuric acid, and nitric acid; toxic gases such as phosphine, arsine, silane, and ozone; and greenhouse gases such as carbon tetrafluoride, sulphur hexafluoride, and nitrogen trifluoride. Each gas behaves differently and must be treated accordingly before it can be safely released.

EcoSys serves this industry from two directions. Our abatement systems capture, treat, and neutralise the harmful process gases generated at every stage of wafer fabrication, helping fabs and equipment manufacturers comply with environmental regulations across every major market. Our ultra-high purity fabrication capability produces the precision weldments, manifolds, and fluid system components that keep semiconductor manufacturing equipment running at the purity levels the process demands.

Key Processes

Wafer Fab Process Challenges

Corrosive Gas Neutralisation

Etching and CVD processes release acidic gases such as hydrogen fluoride and HCl, as well as toxic gases including phosphine, arsine, and silane, requiring robust scrubbing before release.

Particulate Management

Deposition and etching processes release fine dust, particles, and organic compounds that must be captured at the source to prevent equipment fouling and maintain compliance.

Greenhouse Gas Decomposition

Carbon tetrafluoride, sulphur hexafluoride, and nitrogen trifluoride require thermal or plasma abatement to break down these potent greenhouse gases in compliance with emissions targets.

How To Tackle Key Processes

Our Abatement Process, Step by Step

Process Gas Capture

Contaminated gases from etching, CVD, and chamber cleaning processes enter the abatement system through ducts. Fuels such as methane, hydrogen, or LPG, or plasma ions, generate a stable flame or reaction to heat and decompose the incoming gases.

Thermal or Plasma Decomposition

High-temperature combustion or plasma breaks down toxic, flammable, and fluorinated greenhouse gases, reducing their harmful components before they proceed to the scrubbing stage.

Wet Scrubbing & Cooling

Water is sprayed through nozzles to scrub and capture coarse particles and water-soluble gases. Contaminated water is recirculated and only replaced when it reaches specific pH and conductivity parameters, reducing overall water consumption.

Emissions Monitoring

Remaining gases pass through packed bed scrubbers where water establishes a thin film across the packing material, absorbing residual pollutants. The scrubbed gas then passes through a drying zone before being safely discharged.

Frequently Asked Question

Your Questions, Answered

Why is gas abatement critical in semiconductor manufacturing?

Wafer fabrication processes generate acidic, toxic, and greenhouse gases that pose serious risks to personnel, equipment, and the environment. Abatement systems capture and neutralise these gases before they are released, ensuring compliance with environmental regulations in every market where fabs operate.

What types of gases do your abatement systems treat?

What abatement technologies do you use?

Do your systems help with Scope 1 and Scope 2 emissions?

Do you provide installation and maintenance support?

What makes EcoSys different from other abatement providers?